Material Introduction
HT180 is a solvent-free, medium-viscosity, high-precision photopolymer resin for SLA 3D printing. Suitable for DLP and LED light sources, it cures within seconds under 385nm and 405nm exposure. The formulation effectively suppresses light penetration to prevent deep curing, achieving a minimum layer thickness of 0.025mm and high forming accuracy. It features fast curing, low odor and low irritation, and withstands temperatures up to 120°C. It is used for models in architecture, figurines, automotive, medical and consumer electronics, as well as for silicone mold casting of jewelry, hair clips, headwear, figures and hard-gold accessories. Suitable for the Xiaofang D100 DLP 3D printer or similar DLP printers.
Technical Specifications
Specific Gravity
(cm³)
1.1
Viscosity
(cps)
700
Volumetric Shrinkage
(%)
4.5
Tensile Strength
(mpa)
53
Elongation at Break
(%)
4.5
Young's Modulus
(mpa)
2300
Hardness
(Shore D)
90
Glass Transition Temperature
(℃)
180
Material Documents
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