Material Introduction
DHW-G04 is a solvent-free, low-viscosity, high-precision photopolymer resin for SLA 3D printing. Suitable for laser and LED light sources at 385nm and 405nm. The formulation effectively suppresses light penetration to prevent deep curing, achieving a minimum layer thickness of 0.025mm and high forming accuracy. It has low odor, low irritation and a high wax content that makes it easy to cast, though the printed parts are relatively soft and require careful post-curing. Widely used for casting molds for jewelry, hair clips and headwear. Suitable for the Xiaofang D100 DLP 3D printer and similar DLP printers.
Technical Specifications
Specific Gravity
(cm³)
1.02
Viscosity
(cps)
45
Volumetric Shrinkage
(%)
5.8
Tensile Strength
(mpa)
45
Elongation at Break
(%)
6
Young's Modulus
(mpa)
570
Hardness
(Shore D)
60
Glass Transition Temperature
(℃)
42
Material Documents
📭
No downloadable files available