Material Introduction
EC08 is a solvent-free, low-viscosity, high-precision photopolymer resin for SLA 3D printing. It is suitable for laser and LED light sources at 385nm and 405nm. The formulation is optimized to effectively suppress light penetration and prevent deep curing, allowing a minimum layer thickness of 0.025mm per exposure for high forming accuracy. This product has low odor and low irritation, with a high wax content that makes it easy to cast. It is now widely used for casting molds for jewelry, hair clips, headwear and more. Suitable for LCD-series 3D printers.
Technical Specifications
Specific Gravity
(g/cm³)
1.03
Viscosity
(cps)
50
Volumetric Shrinkage
(%)
6
Tensile Strength
(Mpa)
13
Elongation at Break
(%)
15
Young's Modulus
(%)
650
Hardness
(Shore D)
60
Glass Transition Temperature
(℃)
42
Material Documents
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